Research for undergraduate departmental students. May be repeated for a total of twelve credits.

This course will examine electron behavior in a variety of materials and the processing methods used for integrated device production. Additional topics will include thin film growth, diffusion, oxidation, electronic device principals, defect control, and a survey of current challenges to the semiconductor industry.

Microstructure of crystalline ceramics and glasses, and role of thermodynamics and kinetics in its formation. Effect of microstructure on mechanical and physical properties.

Various laboratory experiments that demonstrate behavior of polymers, metals, ceramics, and electronic materials. Includes instruction and practice in use of numerous instruments and equipment, typical of the materials engineering discipline. Data reduction, analysis, and interpretation is covered, as well as correct writing of reports. This course is a Graduation Composition and Communication Requirement (GCCR) course in certain programs, and hence is not likely to be eligible for automatic transfer credit to UK.

A capstone engineering design experience involving analysis, with some treatments of engineering economics of real processes, design of materials, fabrication problems and techniques, and prediction of model material systems.

A study of the structural advantages of composite materials over conventional materials, considering high strength-to-weight and stiffness-to-weight ratios. Fiber reinforced, laminated and particulate materials are analyzed. Response of composite structures to static and dynamic loads, thermal and environmental effects, and failure criteria are studied.

Introductory elasticity and plasticity theory; crystallographic nature of slip and twinning; fracture.

Solidification of molten alloys; fundamentals of metal working; application of metal working theories to forging, rolling, extrusion, drawing and sheet forming.

Overview of materials and processes for the application of plastics in the automotive industry. Engineering properties of plastics, rheology and governing relations for melt process flows. Plastic injection molding including design, control, and simulation of molding operations. Plastic part design and material selection; material testing and quality control.

Study of packaging sysems which interconnect, support, power, cool, protect, and maintain electronic components. The course will address systems at the chip, board, and product levels. Topics include design, properties, materials, manufacture, and performance of various packaging systems. Laboratory will provide familiarity with design software and production equipment and processes.