Study of packaging sysems which interconnect, support, power, cool, protect, and maintain electronic components. The course will address systems at the chip, board, and product levels. Topics include design, properties, materials, manufacture, and performance of various packaging systems. Laboratory will provide familiarity with design software and production equipment and processes.

Study of packaging sysems which interconnect, support, power, cool, protect, and maintain electronic components. The course will address systems at the chip, board, and product levels. Topics include design, properties, materials, manufacture, and performance of various packaging systems. Laboratory will provide familiarity with design software and production equipment and processes.